Granted Patent
Utility
US 5,407,488 · App. 08/134,702
Method and apparatus for in-situ removal of material from openings in a stencil
Inventor:
Rajarshi Ray
Patented Case
View Patent ↗
Granted: Apr 18, 1995
Filed: Oct 12, 1993
Inventor
Rajarshi Ray
Assignee (at issue)
AT&T CORP.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.