Granted Patent
Utility
US 5,416,341 · App. 08/187,471
Substrate for a semiconductor device and method for manufacturing a semiconductor device from the substrate
Inventor:
Hiroshi Hayama
Patented Case
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Granted: May 16, 1995
Filed: Jan 28, 1994
Inventor
Hiroshi Hayama
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.