Granted Patent
Utility
US 5,420,751 · App. 08/133,397
Ultra high density modular integrated circuit package
Inventor:
Carmen D. Burns
Patented Case
View Patent ↗
Granted: May 30, 1995
Filed: Oct 8, 1993
Inventor
Carmen D. Burns
Assignee (at issue)
Staktek Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.