Granted Patent
Utility
US 5,421,985 · App. 07/865,791
Electrodeposited copper foil and process for making same using electrolyte solutions having low chloride ion concentrations
Inventors:
Sidney J. Clouser, Dino F. DiFranco, Craig J. Hasegawa
Patented Case
View Patent ↗
Granted: Jun 6, 1995
Filed: Apr 7, 1992
Inventors
Sidney J. Clouser
Dino F. DiFranco
Craig J. Hasegawa
Assignee (at issue)
Gould Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.