Granted Patent
Utility
US 5,425,982 · App. 08/119,859
Multi-layer wiring structure for semiconductor device and method of making the same
Inventor:
Tatsuya Hara
Patented Case
View Patent ↗
Granted: Jun 20, 1995
Filed: Sep 13, 1993
Inventor
Tatsuya Hara
Assignee (at issue)
NIPPON STEEL CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.