IP Library › Granted Patent US 5,434,751
Granted Patent Utility
US 5,434,751 · App. 08/225,876

Reworkable high density interconnect structure incorporating a release layer

Inventors: Herbert S. Cole, Jr., Theresa Ann Sitnik-Nieters, Robert J. Wojnarowski, John H. Lupinski
Patented Case View Patent ↗
Granted: Jul 18, 1995 Filed: Apr 11, 1994
Inventors
Herbert S. Cole, Jr.
Theresa Ann Sitnik-Nieters
Robert J. Wojnarowski
John H. Lupinski
Assignee (at issue)
LOCKHEED MARTIN CORPORATION

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Quick Facts
Patent No.
US 5,434,751
App. No.
08/225,876
Filed
1994-04-11
Granted
1995-07-18
Kind
A