IP Library Granted Patent US 5,439,849
Granted Patent Utility
US 5,439,849 · App. 08/191,378

Encapsulation techniques which include forming a thin glass layer onto a polymer layer

Inventors: Richard McBride, Ching-Ping Wong
Patented Case View Patent ↗
Granted: Aug 8, 1995 Filed: Feb 2, 1994
Inventors
Richard McBride
Ching-Ping Wong
Assignee (at issue)
AT&T CORP.

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Quick Facts
Patent No.
US 5,439,849
App. No.
08/191,378
Filed
1994-02-02
Granted
1995-08-08
Kind
A