Granted Patent
Utility
US 5,440,239 · App. 08/232,969
Transferable solder bumps for interconnect and assembly of MCM substrates
Inventors:
Pierino I. Zappella, William R. Fewer
Patented Case
View Patent ↗
Granted: Aug 8, 1995
Filed: Apr 25, 1994
Inventors
Pierino I. Zappella
William R. Fewer
Assignee (at issue)
Rockwell International Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.