IP Library Granted Patent US 5,445,974
Granted Patent Utility
US 5,445,974 · App. 08/120,147

Method of fabricating a high-voltage, vertical-trench semiconductor device

Inventor: David Whitney
Patented Case View Patent ↗
Granted: Aug 29, 1995 Filed: Sep 10, 1993
Inventor
David Whitney
Assignee (at issue)
Siemens Components, Inc.

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Quick Facts
Patent No.
US 5,445,974
App. No.
08/120,147
Filed
1993-09-10
Granted
1995-08-29
Kind
A