IP Library › Granted Patent US 5,454,926
Granted Patent Utility
US 5,454,926 · App. 08/363,704

Electrodeposited copper foil

Inventors: Sidney J. Clouser, Dino F. DiFranco, Craig J. Hasegawa
Patented Case View Patent ↗
Granted: Oct 3, 1995 Filed: Dec 23, 1994
Inventors
Sidney J. Clouser
Dino F. DiFranco
Craig J. Hasegawa
Assignee (at issue)
Gould Electronics Inc.

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Quick Facts
Patent No.
US 5,454,926
App. No.
08/363,704
Filed
1994-12-23
Granted
1995-10-03
Kind
A