IP Library Granted Patent US 5,454,928
Granted Patent Utility
US 5,454,928 · App. 08/181,665

Process for forming solid conductive vias in substrates

Inventors: Michael R. Rogers, Theodore Washburn, Michael A. Novice, Ronald S. Besser, Brian Sinclair White
Patented Case View Patent ↗
Granted: Oct 3, 1995 Filed: Jan 14, 1994
Inventors
Michael R. Rogers
Theodore Washburn
Michael A. Novice
Ronald S. Besser
Brian Sinclair White
Assignee (at issue)
Watkins-Johnson Company, Inc.

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Quick Facts
Patent No.
US 5,454,928
App. No.
08/181,665
Filed
1994-01-14
Granted
1995-10-03
Kind
A