Granted Patent
Utility
US 5,455,200 · App. 08/097,505
Method for making a lead-on-chip semiconductor device having peripheral bond pads
Inventors:
Charles G. Bigler, James J. Casto, Michael B. McShane, David D. Afshar
Patented Case
View Patent ↗
Granted: Oct 3, 1995
Filed: Jul 27, 1993
Inventors
Charles G. Bigler
James J. Casto
Michael B. McShane
David D. Afshar
Assignee (at issue)
Motorola, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.