Granted Patent
Utility
US 5,455,462 · App. 08/152,935
Plastic molded package with heat sink for integrated circuit devices
Inventor:
Robert C. Marrs
Patented Case
View Patent ↗
Granted: Oct 3, 1995
Filed: Nov 15, 1993
Inventor
Robert C. Marrs
Assignee (at issue)
Amkor Electronics, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.