Granted Patent
Utility
US 5,455,741 · App. 08/143,306
Wire-lead through hole interconnect device
Inventors:
Ka K. Wai, Moin Ahmad, Aurelio J. Gutierrez, James Douglas Lint
Patented Case
View Patent ↗
Granted: Oct 3, 1995
Filed: Oct 26, 1993
Inventors
Ka K. Wai
Moin Ahmad
Aurelio J. Gutierrez
James Douglas Lint
Assignee (at issue)
Pulse Engineering, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.