IP Library › Granted Patent US 5,456,404
Granted Patent Utility
US 5,456,404 · App. 08/144,844

Method of testing semiconductor chips with reusable test package

Inventors: William C. Robinette, Jr., Chung W. Ho
Patented Case View Patent ↗
Granted: Oct 10, 1995 Filed: Oct 28, 1993
Inventors
William C. Robinette, Jr.
Chung W. Ho
Assignee (at issue)
Digital Equipment Corporation

This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.

Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 5,456,404
App. No.
08/144,844
Filed
1993-10-28
Granted
1995-10-10
Kind
A