Granted Patent
Utility
US 5,463,255 · App. 08/035,638
Semiconductor integrated circuit device having an electrode pad including an extended wire bonding portion
Inventor:
Toshio Isono
Patented Case
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Granted: Oct 31, 1995
Filed: Mar 23, 1993
Inventor
Toshio Isono
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.