IP Library Granted Patent US 5,464,795
Granted Patent Utility
US 5,464,795 · App. 08/203,559

Method of forming polycrystalline silicon thin films for semiconductor devices

Inventor: Shizuo Oguro
Patented Case View Patent ↗
Granted: Nov 7, 1995 Filed: Mar 1, 1994
Inventor
Shizuo Oguro
Assignee (at issue)
NEC CORPORATION

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Quick Facts
Patent No.
US 5,464,795
App. No.
08/203,559
Filed
1994-03-01
Granted
1995-11-07
Kind
A