Granted Patent
Utility
US 5,466,972 · App. 08/239,797
Metallization for polymer-dielectric multichip modules including a Ti/Pd alloy layer
Inventors:
Aaron Frank, Ajibola O. Ibidunni, Douglas B. Johnson, Dennis L. Krause, Trac Nguyen
Patented Case
View Patent ↗
Granted: Nov 14, 1995
Filed: May 9, 1994
Inventors
Aaron Frank
Ajibola O. Ibidunni
Douglas B. Johnson
Dennis L. Krause
Trac Nguyen
Assignee (at issue)
AT&T CORP.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.