Granted Patent
Utility
US 5,477,085 · App. 08/348,822
Bonding structure of dielectric substrates for impedance matching circuits on a packaging substrate involved in microwave integrated circuits
Inventor:
Yasushi Kose
Patented Case
View Patent ↗
Granted: Dec 19, 1995
Filed: Nov 28, 1994
Inventor
Yasushi Kose
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.