Granted Patent
Utility
US 5,478,780 · App. 07/851,245
Method and apparatus for producing conductive layers or structures for VLSI circuits
Inventors:
Heinrich Koerner, Helmuth Treichel, Konrad Hieber, Peter Kuecher
Patented Case
View Patent ↗
Granted: Dec 26, 1995
Filed: Mar 13, 1992
Inventors
Heinrich Koerner
Helmuth Treichel
Konrad Hieber
Peter Kuecher
Assignee (at issue)
Siemens Aktiengesellschaft
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.