IP Library › Granted Patent US 5,482,200
Granted Patent Utility
US 5,482,200 · App. 08/200,038

Method for applying solder to a fine pitch flip chip pattern

Inventors: Bruce A. Myers, Ronnie J. Runyon
Patented Case View Patent ↗
Granted: Jan 9, 1996 Filed: Feb 22, 1994
Inventors
Bruce A. Myers
Ronnie J. Runyon
Assignee (at issue)
DELCO ELECTRONICS CORPORATION

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Quick Facts
Patent No.
US 5,482,200
App. No.
08/200,038
Filed
1994-02-22
Granted
1996-01-09
Kind
A