Granted Patent
Utility
US 5,482,471 · App. 08/197,437
Socket apparatus for IC package testing
Inventors:
Ikuo Mori, Kiyokazu Ikeya
Patented Case
View Patent ↗
Granted: Jan 9, 1996
Filed: Feb 16, 1994
Inventors
Ikuo Mori
Kiyokazu Ikeya
Assignee (at issue)
Texas Instruments Incorporated
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.