Granted Patent
Utility
US 5,483,740 · App. 08/345,573
Method of making homogeneous thermoplastic semi-conductor chip carrier package
Inventor:
William H. Maslakow
Patented Case
View Patent ↗
Granted: Jan 16, 1996
Filed: Nov 28, 1994
Inventor
William H. Maslakow
Assignee (at issue)
AK Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.