Granted Patent
Utility
US 5,485,063 · App. 08/099,623
Motor control circuit for a wire bonding apparatus
Inventors:
Tooru Mochida, Yoshimitsu Terakado, Hijiri Hayashi
Patented Case
View Patent ↗
Granted: Jan 16, 1996
Filed: Jul 30, 1993
Inventors
Tooru Mochida
Yoshimitsu Terakado
Hijiri Hayashi
Assignee (at issue)
SHINKAWA LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.