Granted Patent
Utility
US 5,492,263 · App. 08/250,758
Method for wire bonding an aluminum wire to a lead of an electronics package
Inventors:
Mark E. Webster, John A. Hearn, Daniel R. Bellus, Steven Michael Stansberry, Steven A. Middleton, Ronald D. Myer, Gregory L. Hall
Patented Case
View Patent ↗
Granted: Feb 20, 1996
Filed: May 26, 1994
Inventors
Mark E. Webster
John A. Hearn
Daniel R. Bellus
Steven Michael Stansberry
Steven A. Middleton
Ronald D. Myer
Gregory L. Hall
Assignee (at issue)
DELCO ELECTRONICS CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.