Granted Patent
Utility
US 5,492,586 · App. 08/265,051
Method for fabricating encased molded multi-chip module substrate
Inventor:
Thomas Bert Gorczyca
Patented Case
View Patent ↗
Granted: Feb 20, 1996
Filed: Jun 24, 1994
Inventor
Thomas Bert Gorczyca
Assignee (at issue)
LOCKHEED MARTIN CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.