Granted Patent
Utility
US 5,493,476 · App. 08/445,848
Bus communication system for stacked high density integrated circuit packages with bifurcated distal lead ends
Inventor:
Carmen D. Burns
Patented Case
View Patent ↗
Granted: Feb 20, 1996
Filed: May 22, 1995
Inventor
Carmen D. Burns
Assignee (at issue)
Staktek Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.