Granted Patent
Utility
US 5,495,394 · App. 08/361,062
Three dimensional die packaging in multi-chip modules
Inventors:
Bruce E. Kornfeld, Arthur R. Alexander
Patented Case
View Patent ↗
Granted: Feb 27, 1996
Filed: Dec 19, 1994
Inventors
Bruce E. Kornfeld
Arthur R. Alexander
Assignee (at issue)
AT&T Global Information Solutions Company
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.