Granted Patent
Utility
US 5,497,033 · App. 08/262,181
Embedded substrate for integrated circuit modules
Inventors:
Raymond Albert Fillion, Robert J. Woinarowski, Michael Gdula, Herbert S. Cole, Jr., Eric J. Wildi, Wolfgang Daum
Patented Case
View Patent ↗
Granted: Mar 5, 1996
Filed: Jun 20, 1994
Inventors
Raymond Albert Fillion
Robert J. Woinarowski
Michael Gdula
Herbert S. Cole, Jr.
Eric J. Wildi
Wolfgang Daum
Assignee (at issue)
LOCKHEED MARTIN CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.