Granted Patent
Utility
US 5,502,005 · App. 08/160,351
Production method of semiconductor device having a wiring layer containing gold
Inventor:
Kaoru Mikagi
Patented Case
View Patent ↗
Granted: Mar 26, 1996
Filed: Nov 29, 1993
Inventor
Kaoru Mikagi
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.