IP Library Granted Patent US 5,502,007
Granted Patent Utility
US 5,502,007 · App. 08/283,295

Method of forming flat surface of insulator film of semiconductor device

Inventor: Hiroshi Murase
Patented Case View Patent ↗
Granted: Mar 26, 1996 Filed: Jul 28, 1994
Inventor
Hiroshi Murase
Assignee (at issue)
NEC CORPORATION

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Quick Facts
Patent No.
US 5,502,007
App. No.
08/283,295
Filed
1994-07-28
Granted
1996-03-26
Kind
A