Granted Patent
Utility
US 5,503,321 · App. 08/317,602
Bonding tool employed in ultrasonic compression bonding apparatus
Inventor:
Michitaka Urushima
Patented Case
View Patent ↗
Granted: Apr 2, 1996
Filed: Sep 29, 1994
Inventor
Michitaka Urushima
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.