IP Library › Granted Patent US 5,505,367
Granted Patent Utility
US 5,505,367 · App. 08/333,168

Method for bumping silicon devices

Inventors: Yinon Degani, Thomas Dixon Dudderar, John G. Spadafora
Patented Case View Patent ↗
Granted: Apr 9, 1996 Filed: Nov 2, 1994
Inventors
Yinon Degani
Thomas Dixon Dudderar
John G. Spadafora
Assignee (at issue)
AT&T CORP.

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Quick Facts
Patent No.
US 5,505,367
App. No.
08/333,168
Filed
1994-11-02
Granted
1996-04-09
Kind
A