Granted Patent
Utility
US 5,505,833 · App. 08/272,589
Method for depositing a layer on a substrate wafer with a sputtering process
Inventors:
Christoph Werner, Alfred Kersch
Patented Case
View Patent ↗
Granted: Apr 9, 1996
Filed: Jul 11, 1994
Inventors
Christoph Werner
Alfred Kersch
Assignee (at issue)
Siemens Aktiengesellschaft
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.