Granted Patent
Utility
US 5,506,448 · App. 08/361,970
Semiconductor integrated circuit device having an improved packaging structure
Inventor:
Sueo Morishige
Patented Case
View Patent ↗
Granted: Apr 9, 1996
Filed: Dec 22, 1994
Inventor
Sueo Morishige
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.