Granted Patent
Utility
US 5,508,230 · App. 08/416,236
Method for making a semiconductor device with diamond heat dissipation layer
Inventors:
George F. Anderson, Randy L. Pollock
Patented Case
View Patent ↗
Granted: Apr 16, 1996
Filed: Apr 4, 1995
Inventors
George F. Anderson
Randy L. Pollock
Assignee (at issue)
Motorola, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.