Granted Patent
Utility
US 5,508,558 · App. 08/144,842
High density, high speed, semiconductor interconnect using-multilayer flexible substrate with unsupported central portion
Inventors:
William C. Robinette, Jr., Chung W. Ho
Patented Case
View Patent ↗
Granted: Apr 16, 1996
Filed: Oct 28, 1993
Inventors
William C. Robinette, Jr.
Chung W. Ho
Assignee (at issue)
Digital Equipment Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.