Granted Patent
Utility
US 5,514,451 · App. 08/379,265
Conductive via fill inks for ceramic multilayer circuit boards on support substrates
Inventors:
Ananda H. Kumar, Barry Jay Thaler, Ashok N. Prabhu, Ellen S. Tormey
Patented Case
View Patent ↗
Granted: May 7, 1996
Filed: Jan 27, 1995
Inventors
Ananda H. Kumar
Barry Jay Thaler
Ashok N. Prabhu
Ellen S. Tormey
Assignee (at issue)
David Sarnoff Research Center Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.