IP Library Granted Patent US 5,523,921
Granted Patent Utility
US 5,523,921 · App. 08/370,770

Printed circuit assembly having improved reference plane isolation

Inventor: Curt N. Van Lydegraf
Patented Case View Patent ↗
Granted: Jun 4, 1996 Filed: Dec 22, 1994
Inventor
Curt N. Van Lydegraf
Assignee (at issue)
Hewlett-Packard Company, L.P.

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Quick Facts
Patent No.
US 5,523,921
App. No.
08/370,770
Filed
1994-12-22
Granted
1996-06-04
Kind
A