IP Library › Granted Patent US 5,527,741
Granted Patent Utility
US 5,527,741 · App. 08/321,346

Fabrication and structures of circuit modules with flexible interconnect layers

Inventors: Herbert S. Cole, Jr., Raymond Albert Fillion, Bernard Gorowitz, Ronald Frank Kolc, Robert J. Wojnarowski
Patented Case View Patent ↗
Granted: Jun 18, 1996 Filed: Oct 11, 1994
Inventors
Herbert S. Cole, Jr.
Raymond Albert Fillion
Bernard Gorowitz
Ronald Frank Kolc
Robert J. Wojnarowski
Assignee (at issue)
LOCKHEED MARTIN CORPORATION

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Quick Facts
Patent No.
US 5,527,741
App. No.
08/321,346
Filed
1994-10-11
Granted
1996-06-18
Kind
A