Granted Patent
Utility
US 5,528,080 · App. 08/355,026
Electrically conductive interconnection through a body of semiconductor material
Inventor:
Edward Goldstein
Patented Case
View Patent ↗
Granted: Jun 18, 1996
Filed: Dec 13, 1994
Inventor
Edward Goldstein
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.