Granted Patent
Utility
US 5,529,670 · App. 08/172,017
Method of depositing conductors in high aspect ratio apertures under high temperature conditions
Inventors:
James G. Ryan, David C. Strippe, Bernd Vollmer
Patented Case
View Patent ↗
Granted: Jun 25, 1996
Filed: Dec 22, 1993
Inventors
James G. Ryan
David C. Strippe
Bernd Vollmer
Assignees (at issue)
International Business Machines Corporation
Siemens Aktiengesellschaft
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.