Granted Patent
Utility
US 5,529,947 · App. 08/356,509
Semiconductor device with clad substrate and fabrication process therefor
Inventor:
Kensuke Okonogi
Patented Case
View Patent ↗
Granted: Jun 25, 1996
Filed: Dec 15, 1994
Inventor
Kensuke Okonogi
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.