Granted Patent
Utility
US 5,535,006 · App. 08/250,078
Method and system for evaluating integrity of adherence of a conductor bond to a mating surface of a substrate
Inventors:
Kenneth L. Telschow, Bernard Siu
Patented Case
View Patent ↗
Granted: Jul 9, 1996
Filed: May 26, 1994
Inventors
Kenneth L. Telschow
Bernard Siu
Assignee (at issue)
Lockheed Idaho Technologies Company
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.