Granted Patent
Utility
US 5,542,874 · App. 08/306,974
Wafer polishing apparatus
Inventor:
Shinichi Chikaki
Patented Case
View Patent ↗
Granted: Aug 6, 1996
Filed: Sep 16, 1994
Inventor
Shinichi Chikaki
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.