IP Library Granted Patent US 5,543,919
Granted Patent Utility
US 5,543,919 · App. 08/309,516

Apparatus and method for performing high spatial resolution thin film layer thickness metrology

Inventor: Peter B. Mumola
Patented Case View Patent ↗
Granted: Aug 6, 1996 Filed: Sep 20, 1994
Inventor
Peter B. Mumola
Assignee (at issue)
Integrated Process Equipment Corporation

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Quick Facts
Patent No.
US 5,543,919
App. No.
08/309,516
Filed
1994-09-20
Granted
1996-08-06
Kind
A