IP Library Granted Patent US 5,548,136
Granted Patent Utility
US 5,548,136 · App. 08/272,041

Substrate with a compound semiconductor surface layer and method for preparing the same

Inventor: Shuji Asai
Patented Case View Patent ↗
Granted: Aug 20, 1996 Filed: Jul 8, 1994
Inventor
Shuji Asai
Assignee (at issue)
NEC CORPORATION

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Quick Facts
Patent No.
US 5,548,136
App. No.
08/272,041
Filed
1994-07-08
Granted
1996-08-20
Kind
A