Granted Patent
Utility
US 5,554,889 · App. 08/430,105
Structure and method for metallization of semiconductor devices
Inventors:
Hank Hukyoo Shin, Clarence J. Tracy, Robert L. Duffin, John L. Freeman, Jr., Gordon M. Grivna, Syd R. Wilson
Patented Case
View Patent ↗
Granted: Sep 10, 1996
Filed: Apr 27, 1995
Inventors
Hank Hukyoo Shin
Clarence J. Tracy
Robert L. Duffin
John L. Freeman, Jr.
Gordon M. Grivna
Syd R. Wilson
Assignee (at issue)
Motorola, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.