Granted Patent
Utility
US 5,565,705 · App. 08/235,992
Electronic module for removing heat from a semiconductor die
Inventors:
Guillermo L. Romero, Joe L. Martinez, Jr.
Patented Case
View Patent ↗
Granted: Oct 15, 1996
Filed: May 2, 1994
Inventors
Guillermo L. Romero
Joe L. Martinez, Jr.
Assignee (at issue)
Motorola, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.