Granted Patent
Utility
US 5,568,683 · App. 08/472,320
Method of cooling a packaged electronic device
Inventors:
Chok J. Chia, Manian Alagaratnam, Qwai H. Low, Seng-Sooi Lim
Patented Case
View Patent ↗
Granted: Oct 29, 1996
Filed: Jun 7, 1995
Inventors
Chok J. Chia
Manian Alagaratnam
Qwai H. Low
Seng-Sooi Lim
Assignee (at issue)
LSI Logic Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.